Cleanroom and Semiconductor Equipment

blades

Dicing Blades

Keteca Diamablade

In today’s technology, the standard diamond dicing blade in the market uses nickel to bind the diamond in place.

Keteca’s patented technology has proven to improve blade life and blade quality. By adding Single Crystal Silicon Carbide Whisker (SiCw) to the nickel diamond plating process, the whisker reinforces the nickel alloy matrix holding the diamond in place. This increases the tensile and bend strength, thereby improving the strength of the blade allowing a better cut quality and wear rate.


Distinctive Qualities of Keteca Diamablade

• Stronger Blade
• Extended Wear Rate
• Better Cut Quality
• Improved Kerf Width
• Lesser Chipping
• Improved Diamond Exposure resulting in lesser dressing of blade

 

 

Keteca Diamablade

For a free trial - Call us on +44 (0)2380 760 909 or e-mail info@U4Global.com